- wafer cleaning
- n.圆片清洗,晶片清洗
English-Chinese dictionary of mining (英汉矿业大词典). 2013.
wafer cleaning
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Wafer-Spülverfahren — Unter Wafer Spülverfahren (englisch wafer rinse) werden eine Gruppe von Behandlungsmethoden zusammengefasst, mit deren Hilfe Verunreinigungen von der Scheibenoberfläche beseitigt werden sollen. Die Spülverfahren sind im Allgemeinen… … Deutsch Wikipedia
Wafer (electronics) — Polished 12 and 6 silicon wafers. The flat cut into the right wafer indicates its doping and crystallographic orientation (see below) … Wikipedia
Megasonic cleaning — is a type of acoustic cleaning, related to ultrasonic cleaning. It is a gentler cleaning mechanism, less likely to cause damage, and is used in wafer, medical implant, and industrial part cleaning. Similar to ultrasonic cleaning, megasonics… … Wikipedia
Microfabrication — Synthetic detail of a micromanufactured integrated circuit through four layers of planarized copper interconnect, down to the polysilicon (pink), wells (greyish) and substrate (green) Microfabrication is the term that describes processes of… … Wikipedia
RCA clean — The RCA clean is a standard set of wafer cleaning steps which needs to be performed before high temp processing steps (oxidation, diffusion, CVD) of silicon wafers in semiconductor manufacturing. Werner Kern developed the basic procedure in 1965… … Wikipedia
Gasphasenzersetzung — Die Gasphasenzersetzung (englisch vapour phase decomposition, VPD) ist eine Probenpräparationsmethode der Analytischen Chemie zur Aufkonzentration von vorrangig metallischen Verunreinigungen auf (Silizium )Proben. Sie wird unter anderem in… … Deutsch Wikipedia
Semiconductor International — Infobox Newspaper name = Semiconductor International caption = type = business magazine format = Paper and online magazine foundation = 1978 ceased publication = price = owners = Reed Business Information editor = Laura Peters founder = language … Wikipedia
CAWC — Companion Animal Welfare Council (Medical » Veterinary) ** California Software Corporation (Business » NASDAQ Symbols) * Cryogenic Aerosol Wafer Cleaning (Academic & Science » Electronics) … Abbreviations dictionary
Direct bonding — describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between two surfaces of any material possible meeting numerous requirements.[1] These requirements are specified for the… … Wikipedia
Photolithography — For earlier uses of photolithography in printing, see Lithography. For the same process applied to metal, see Photochemical machining. Photolithography (or optical lithography ) is a process used in microfabrication to selectively remove parts of … Wikipedia
Probe card — A probe card is an interface between an electronic test system and a semiconductor wafer. Its purpose is to provide an electrical path between the test system and the circuits on the wafer, thereby permitting the testing and validation of the… … Wikipedia
